The Hong Kong Science and Technology Parks Corporation (HKSTP) showcased 30 fintech innovations from 2 to 3 November 2023 at Hong Kong Fintech Week 2023.

The innovations were presented by 30 park companies from various sectors, including AI, digital asset/Web 3.0, Environmental, Social, and Governance (ESG), and regulatory technology (regtech).

The HKSTP Pavilion also hosted 100 business matching engagements between the park companies and renowned major corporates from banking, financial services, and insurance.

These engagements were in line with this year’s Hong Kong Fintech Week theme of “Fintech Redefined” and HKSTP’s commitment to being a catalyst for collaboration and partnerships.

HKSTP is also working closely with the Hong Kong Monetary Authority (HKMA) and Insurance Authority (IA) to encourage banking and insurance stakeholders to collaborate for digital innovation through the use of APIs.

Additionally, HKSTP is also offering up-and-coming fintechs the opportunity to join its annual flagship startup event – Elevator Pitch Competition 2024 (EPiC 2024), a global pitching competition, which will take place across four global cities.

All applicants of EPiC 2024 will have an opportunity to seek investment from HKSTP Corporate Venture Fund up to US$5 million.

The competition also offers a total of US$240,000 in cash prizes, business matching and funding opportunities, plus the ideal springboard to huge market opportunities in Mainland China, across Asia and beyond.

Albert Wong, CEO, HKSTP said,

“For fintech to truly flourish, there must be cross-industry collaboration, co-creation and co-innovation. HKSTP is cultivating our park companies to commercialise their fintech solutions from R&D results to market adoption.

 

HKSTP’s world-class I&T ecosystem is enabling fintech innovators and pioneers to collaborate for global success, shaping the future of fintech and advancing Hong Kong’s digital economy.”