The Hong Kong University of Science and Technology (HKUST) signed a Memorandum of Understanding (MoU) with the Tencent Finance Academy (TFAHK) to nurture fintech talent.
Leveraging HKUST’s academic foundation in fintech and Tencent’s practical industry experience, the MoU aims to establish a strategic partnership in fostering the development of fintech by nurturing talents and collaborating on education and research and development projects.
It sets out the plan for both parties to collaborate on the fintech case study series for tertiary education purpose, with the goal to provide real business cases for students to comprehensively improve their knowledge on fintech.
The parties will also work together on developing a curriculum on fintech, with HKUST integrating Tencent’s extensive business experience to promote the development of an innovative talent model.
Other initiatives include internship opportunities for HKUST students, joint fintech-related research and development projects, guidance on conducting research projects and potential education outreach programs to improve public awareness on fintech.
Hong Kong’s Chief Executive Carrie Lam said in her speech,
“I thank TFAHK for its long-standing commitment to and support for nurturing young fintech talents, and I hope all young people attending the forum today can equip themselves to take part in the integration of fintech development in the GBA.
This will provide better career development for themselves and contribute to the development of Hong Kong, the GBA and the nation.”
HKUST President Prof. Wei Shyy said,
“We have launched our first fintech postgraduate program jointly by Schools of Business and Management, Engineering, and Science. We have also been actively collaborating with multiple banks and other enterprises.
Today we are delighted to join hands with Tencent to further our efforts on creating new knowledge and nurturing talent in a context which HKUST can make substantial contributions.”
Featured image: HKUST and TFAHK representatives signing the MoU
